This study explores the capability of Thermal Desktop to map temperatures from a thermal model to a Nastran model to evalautate thermal stress and distortion
A cryogenic capillary pumped loop (CPL) has been developed, designed, fabricated and successfully demonstrated by test. Using no moving parts, the novel device is able to start from a supercritical state and cool a remote dissipation source to 80-90K. Design studies were conducted for integration requirements and component design optimization and prototype units were designed, fabricated and successfully tested with excellent results.
Active cooling technologies such as heat pipes, loop heat pipes (LHPs), thermosyphons, loop thermosyphons (LTSs), and pumped single- or two-phase coolant loops require specialized modeling treatment. However, these 1D ducted systems are largely overlooked in 3D thermal modeling tools. The increasing popularity of CFD and FEM models and generation of analysis data from 3D CAD data are strong trends in the thermal analysis community, but most software answering such demands has not provided linear modeling elements appropriate for the simulation of heat pipes and coolant loops.
Thermal engineering has long been left out of the concurrent engineering environment dominated by CAD (computer aided design) and FEM (finite element method) software. Current tools attempt to force the thermal design process into an environment primarily created to support structural analysis, which results in inappropriate thermal models. As a result, many thermal engineers either build models “by hand” or use geometric user interfaces that are separate from and have little useful connection, if any, to CAD and FEM systems.