This document summarizes the activities of the WPI Nanosat-3 (N3) program proposed in response to a BAA by the AFOSR and AIAA (University Nanosat Program, AFOSR BAA 2003-02) . Specifically, we proposed to have WPI undergraduate and graduate student teams under the direct guidance of WPI faculty, develop a nanosat that would be used as a vehicle to investigate:

Complex products are best developed in a collaborative design environment where engineering data and CAD/CAE results can be shared across engineering discipline boundaries within a common software interface. A new software tool that allows Electro-Optical (EO) sensors to be developed in this manner has been used to conduct an integrated Structural/Thermal/Optical (STOP) analysis of a critical lens subassembly in a flight payload. This paper provides a description of the software environment and a summary of the technical results that were produced with it.

Modeling to predict the condition of cryogenic propellants in an upper stage of a launch vehicle is necessary for mission planning and successful execution. Traditionally, this effort was performed using custom, in-house proprietary codes, limiting accessibility and application. Phenomena responsible for influencing the thermodynamic state of the propellant have been characterized as distinct events whose sequence defines a mission. These events include thermal stratification, passive thermal control roll (rotation), slosh, and engine firing.

Despite recent advances in computer aided design (CAD) based tools, spacecraft thermal analysis remains outside the realm of finite element method (FEM) based analysis. The primary complaints against FEM often cited are:

Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible.

Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal DesktopTM to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes.