The major influence on the reliability of electronics is temperature, yet thermal/fluid modeling is plagued with uncertainties and unknowns. Nonetheless, if appropriate values of these unknown parameters are available for any specific electronics package, then its temperature response can be accurately predicted using modern thermal/fluid analysis tools.

Nonlinear Programming Applied to Calibrating Thermal and Fluid Models to Test Data (Semi-Therm 2002)

This paper describes readily available techniques for automating the search for worst-case (e.g., “hot case”, “cold case”) design scenarios using only modest computational resources. These methods not only streamline a repetitive yet crucial task, they usually produce better results.

The problems with prior approaches are summarized, then the improvements are demonstrated via a simplified example that is analyzed using various approaches. Finally, areas for further automation are outlined, including attacking the entire design problem at a higher-level.

Thankfully, the age of stand-alone fixed-input simulation tools is fading away in favor of more flexible and integrated solutions. “Concurrent engineering” once meant automating data translations between monolithic codes, but sophisticated users have demanded more native integration and more automated tools for designing, and not just evaluating point designs. Improvements in both interprocess communications technology and numerical solutions have gone a long way towards meeting those demands.

The loop heat pipe (LHP) is known to have a lower limit on input power. Below this limit the system may not start properly creating the potential for critical payload components to overheat. The LHP becomes especially susceptible to these low power start-up failures following diode operation, intentional shut-down of the device, or very cold conditions. These limits are affected by the presence of adverse tilt, mass on the evaporator, and noncondensible gas in the working fluid.

The NASA standard tool for thermohydraulic analysis, SINDA/FLUINT, includes thermodynamic and hydrodynamic solutions specifically targeted at the growing demand for design and analysis of liquid propulsion systems. Applications in this field have included:

This paper describes the application of the general purpose SINDA/FLUINT thermohydraulic analyzer to the modeling of vapor compression (VC) cycles such as those commonly used in automotive climate control and building HVAC systems. The software is able to simulate transient operation of vapor compression cycles, predicting pressures, coefficients of performance, and condenser/evaporator liquid positions in a closed two-phase system with a fixed fluid charge.

This paper describes a new means of analyzing the thermal response of air-cooled and liquid-cooled electronics that overcomes limitations in available tools and current design methods. It also shows how these new tools and methods can extend the reach of such thermal/fluid analyses by helping to size and locate components as well as dealing with both pre-test uncertainties and post-deployment variations in manufacturing, environment, and usage.

Modeling lessons learned form Ford, Visteon, GM, Delpi, Danfoss, etc.

e-Thermal is a vehicle level thermal analysis tool developed by General Motors to simulate the transient performance of the entire vehicle HVAC and Powertrain cooling system. It is currently in widespread (global) use across GM. This paper discusses the details of the airconditioning module of e-Thermal. Most of the literature available on transient modeling of the air conditioning systems is based on finite difference approach that require large simulation times. This has been overcome by appropriately modeling the components using Sinda/Fluint.