Productivity bottlenecks for integrated thermal, structural, and optical design activities were identified and systematically eliminated, making possible automated exchange of design information between different engineering specialties.

This paper provides an overview of the non-grey radiation modeling capabilities of Cullimore and Ring’s Thermal Desktop® Version 4.8 SindaWorks software. The non-grey radiation analysis theory implemented by Sindaworks and the methodology used by the software are outlined.

SINDA/FLUINT (Ref 1-7) is the NASA-standard heat transfer and fluid flow analyzer for thermal control systems. Because of its general formulation, it is also used in other aerospace specialties such as environmental control (ECLSS) and liquid propulsion, and in terrestrial industries such as electronics packaging, refrigeration, power generation, and transportation industries.

This paper describes revolutionary advances in SINDA/FLUINT, the NASA-standard heat transfer and fluid flow analyzer, changing it from a traditional point-design simulator into a tool that can help shape preliminary designs, rapidly perform parametrics and sensitivity studies, and even correlate modeling uncertainties using available test data.

Recent years have witnessed more improvement to the SINDA/FLUINT thermohydraulic analyzer than at any other time in its long history. These improvements have included not only expansions in analytic power, but also the additions of high-level modules that offer revolutions in thermal/ fluid engineering itself.

Thankfully, the age of stand-alone fixed-input simulation tools is fading away in favor of more flexible and integrated solutions. “Concurrent engineering” once meant automating data translations between monolithic codes, but sophisticated users have demanded more native integration and more automated tools for designing, and not just evaluating point designs. Improvements in both interprocess communications technology and numerical solutions have gone a long way towards meeting those demands.

Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal DesktopTM to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes.