SINDA/FLUINT
has been widely used for thermal modeling of
electronics in the aerospace industry over the
past two decades. The FLUINT component of the
code differentiates our product from other network
style solvers by expanding the applicability
of the code to ground based electronics with
convective environments, liquid cooling, and
two-phase cooling
loops. The geometric interface of FloCAD®
expands SINDA/FLUINT's capabilities to include
3D CAD methods for simulating air cooling and
thermal behavior of electronic enclosures, PC
boards, heat sinks, and electronic racks.
The
ability to import board models TASPCB,
Harvard Thermal's printed circuit board modeling
software, provides the designer indirect access
to ECAD data. This increases the accuracy of
system level board models in FloCAD by including
the effects of all traces, vias, and components
on the boards. Learn
more about the TASPCB interface.
Our
suite of tools provides the unique ability to perform
integrated thermalhydraulic modeling of enclosures,
capturing both the thermal and fluid (thermalhydraulic)
aspects of mass and heat transfer. In many instances,
our code can replace the need for high cost, time
consuming CFD analyses. The user-friendly interface
provides the designer the ability to quickly model
a system yet provides the flexibility to easily
perform sensitivity parametrics, optimization, and
other high level operations related to sizing and
reliability estimation.
Electronic
Enclosure
Postprocessed
PC Board
The
user has the ability to model fans, pumps, ducts,
valves, filter, and other miscellaneous loss
elements. Fluids may be selected from the built
in property data base or the user may specify
his/her own fluid properties. The most common
choices for air cooled electronics include dry
and moist air (including condensation and other
psychometric effects), and for coolant loop
fluids choices include water, water-glycol,
PAO, etc. Even two-phase systems such as
vapor compression cycle refrigeration systems
can be modeled quickly and reliably.
Heat
Distribution
for Active Cold Plates
Highlights
of capabilities
An
inexpensive fast-to-model and fast-to-solve alternative
to CFD for air-cooled electronics
Fully
parametric for easy model changes
The
only piping network code for coolant loops and heat
pipes that lets you lay out 1D lines within 3D thermal/structural
geometry
Best-of-class
design and analysis software for vapor compression
refrigeration cycles and other two-phase systems such
as spray cooling loops, heat pipes, loop heat pipes,
and thermosyphons
Best-of-class
CAD-based and FEM-compatible thermal radiation, conduction,
and contact resistance modeling tools.
Advanced
analysis methods for sizing/optimization, automated
model calibration to test data, and statistical design
including tolerancing and reliability studies
